Electrochemical Deposition and SEM Surface morphology of Co and UHMWPE/Co Composite Layers
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Date
2009Author
Benea, Lidia
Mardare-Pralea, Marilena
Cojocaru, Paula
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The work aims at obtaining composite coatings in cobalt matrix with dispersed
phase UHMWPE (ultra high molecular weight polyethylene) and at characterizing
the surface morphology analyse by SEM, the thickness of the deposited layers and
the microhardness of Co and Co/UHMWPE composite coatings. All coatings were
obtained on stainless steel plates (304L). The electro-deposition of these metal and
composite layers is a process consisting of inclusion of UHMWPE (ultra high
molecular weight polyethylene) particles in the cobalt matrix during electroplating
process. The dispersed particles were suspended in a sulphate cobalt plating
electrolyte within the metal which electro-crystallizes and forms the metal matrix.
By means of the potentiostat a number of five current densities were applied during
deposition as follow: 23 mA/cm2, 48 mA/cm2, 72mA/cm2, 96mA/cm2 and 120mA/cm2.
Keeping particles in suspension was ensured by magnetically stirring at a rotation
speed of 300 rotations per minute. After processing the results, it has been noticed
that with increasing current density there is an increase in the pure Co layer
thickness too as well as in the UHMWPE/Co layers thickness. Adding particles
UHMWPE particles in the electrolyte solution, the composite layers thickness is
greater as compared with the thickness of pure Co layer obtained under the same
electrodeposition conditions. UHMWPE was selected as surface modifier element,
due to its high biocompatibility and excellent wear behaviour being used in many
biomedical applications. Cobalt is already used in many cobalt alloys as biomedical
implants as cobalt – chromium alloys. UHMWPE is also used as bio-polymer in
many implants. The metal-matrix composites are materials in which the properties
of a metallic host material are modified with addition of a second phase (ceramics,
polymers, etc.) by electrodeposition process.
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- 2009 fascicula9 nr1 [33]