Căutare 2005 fascicula9 nr2 după Subiect "cutting"
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Aspects Regarding the Widia Plates Behaviour Covered with TiN During the Cutting Process
(Universitatea "Dunărea de Jos" din Galați, 2005)The microscopic property that depends on the interfacial structure and on the tension to which the interface is submitted is called adherence. The strong connection in the interfacial area, low tension gradients, the ...